GEMBIRD TG-G15-02 heat sink compound Thermal paste 4.63 W/m·K 24 g

Thermal silicone compound (grease) for heatsinks<br>Helps the heat dissipation from a CPU, chipset or processor to a heatsink<br>Excellent thermal impedance<br>Perfect stability — will not separate, run, migrate, or bleed<br>Non capacitive or electrically conductiveGembird TG-G15-02. Type: Thermal paste, Thermal conductivity: 4.63 W/m·K, Density: 3.15 g/cm³. Width: 30 mm, Depth: 35 mm, Height: 30 mm. Quantity per pack: 400 pc(s), Package width: 30 mm, Package depth: 35 mm. Country of origin: China